Silver powder has a wide range of applications in various fields due to its excellent conductivity, weldability, and stability. Based on your description, the following are the main application areas of our silver powder:

1. Spherical silver powder: Due to its unique spherical structure, it can provide better fluidity and filling properties, making it particularly suitable for applications that require high-temperature sintering. It is mainly used in ceramic metallization paste, front or back of photovoltaic cells, heterojunction silver paste, internal and terminal electrode paste of chip inductors, as well as thick film integrated circuits. These applications typically require materials to have good conductivity and heat resistance.

2. Silver powder for touch screen silver paste: designed to meet the needs of the touch screen (TP) industry, suitable for making silver paste, laser engraved silver paste, conductive silver paste, etc. required for touch screen production. Due to the high material requirements of touch screen technology, such as good transparency, conductivity, and flexibility, this type of silver powder usually needs to have a lower sintering temperature to meet the needs of different substrates.

3. Solar backed silver powder: specially designed for the photovoltaic industry, especially used in the preparation process of the back electrode of solar panels. This silver powder helps improve the energy conversion efficiency of solar cells and can withstand high temperature processing during the manufacturing process. In addition, it is also used in slurries for ceramic metallization.

4. Ultra fine silver powder: Ultra fine silver powder has a larger surface area to volume ratio, which makes it very suitable for applications that require high conductivity but cannot withstand high sintering temperatures, such as some medium and low temperature sintered conductor pastes. This type of silver powder can improve the overall performance of the product, such as reducing resistance and increasing adhesion.

5. Low bulk density flake silver powder: The characteristic of this silver powder is that it has a lower bulk density, which means it contains more silver powder particles in the same volume, thereby reducing the amount of silver powder used and lowering costs without sacrificing conductivity. It is often used as the main filler for low silver content low-temperature curing electronic pastes, such as thin film switches, carbon film potentiometers, silver pastes, and other applications.

Silver powder of different types and characteristics has been optimized for different application scenarios to meet the specific requirements of various industries for material properties.