Spherical (quasi spherical) silver powder has the characteristics of high crystallinity, high sphericity, easy dispersion, high filling density, and low sintering shrinkage rate. It is mainly used as the main filler for ceramic metallization paste, photovoltaic cell front/back/heterojunction silver paste, chip inductor internal electrode paste and terminal electrode paste, and thick film integrated circuit and other high-temperature sintered conductor paste.
+86-18988684013Powder growth mechanism, component segregation, particle size and distribution, microstructure control, aggregation, surface state and purity control methods, etc.
High temperature reaction process, process thermodynamics, and kinetic laws.
Multi component combination relationship, homogeneous mixing, crushing, dispersibility, surface additive combination, stability and adaptability control.
Process energy efficiency management and lean production management.
| Model | ZRYF-01 |
| Application Areas | Medium and high temperature sintering conductor paste |
| Average particle size (μm) | 1.80-3.00 |
| Bulk density (g/cm³ ) | 1.80-2.50 |
| Tap density (g/cm³ ) | 3.50-5.00 |
| Specific surface area （m²/g） | 0.30-0.55 |
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Electron microscope image |
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