The product is a silver gray paste like fluid, mainly composed of silver powder, glass powder, and organic adhesive. It does not contain prohibited substances such as lead, cadmium, or hexavalent chromium, and meets the environmental requirements of the RoHS directive. It is used as a terminal electrode for chip inductors and chip NTC thermistors.
+86-18988684013Control of characteristics such as particle size, morphology, specific surface area, and surface modification of metal/ceramic powders.
Control of physical and chemical properties, sintering performance, etc. of inorganic additives (glass, microcrystalline glass).
Control of rheological properties, viscosity, dispersibility, and mesh passing characteristics of organic carriers.
Matching with substrate, upper and lower functional layers (Ohmic contact, co firing, electronic energy level matching, etc.).
Batch supply applicable window width, product batch stability, high reliability.
| Model | Solids(%) |
Viscosity(Pa.S) |
Sintering temperature(℃) |
Application |
| BSG90-01 | 89.0±1.0 | 250-350 | 915±10 | Internal paste for chip inductors |
| BSG88-01 | 87.5±0.8 | 150±50 | 850-930 | Internal slurry for wet process chip inductors |
| BSG85-01 | 84.5±1.0 | 150±20 | 915±10 | Internal paste for chip inductors |
| BIG88-01 | 87.5±0.5 | 250±50 | Dot paste for chip inductors | |
| BIG84-01 | 83.0±1.0 | 250±50 | Dot paste for chip inductors | |
| (Note: The viscosity detection conditions are Brookfield HBDV - Ⅱ+, CP52, 25 ± 0.5 ℃, 1.0rpm) | ||||
